无铅波峰焊,Lead-free wave soldering
1)Lead-free wave soldering无铅波峰焊
1.Solution and Method of Reducing Solder Dross in Lead-free Wave Soldering;无铅波峰焊钎料氧化渣的减少措施
英文短句/例句
1.Corrosion Research of Different Lead Free Wave Solder Pot Materials;无铅波峰焊不同锡炉材料溶蚀行为研究
2.Effect of Trace Phosphorus on the Oxidation Resistance of Lead-Free Solder Used in Wave Soldering;微量磷对无铅波峰焊钎料抗氧化性影响的研究
3.Research of Lead-Free Wave-Soldering System Based on IPC基于工控机的无铅波峰焊接机系统的研究
4.Production Characteristic of the Solder Dross during Lead-Free Wave Soldering and Process Solution of Reducing It;无铅波峰焊钎料氧化渣形成特点及其改善的工艺措施
5.WS Wave Soldering波峰焊接，THT元件的焊接方式
6.activated rosin flux for wave soldering松香型波峰焊用活性助焊剂
7.Establishment and Analysis of Wave Soldering Solder Joints Finite Element Model波峰焊焊点有限元模型的建立与分析
8.Study of the Reliability of Power Device with Lead-free Heat-sink Attachment;功率器件无铅焊料焊接层可靠性研究
9.Properties of Sn-3.0Ag-0.5Cu-xNi lead-free solders and soldering jointsSn-3.0Ag-0.5Cu-xNi无铅焊料及焊点的性能
10.Pb-free solders– Sn-Bi-Zn based with our own patent and their modification to fit for package applications.无铅焊锡—锡铋锌系无铅焊锡，材料设计、发，焊料（球、膏）发等。
11.Pb-free solders ? Sn-Bi-Zn based with our own patent and their modification to fit for package applications.无铅焊锡—锡铋锌系无铅焊锡，材料设计、开发，焊料（锡球、锡膏）开发等。
12.Maintenance the Wave soldering(WS) machine to ensure the maximum capability and efficiency. Trouble shooting.即时修护波峰焊机器产生之问题，维持波峰焊最佳之产能与效率。
13.Clear how to measuring reflow and wave profile.清楚怎样测量回流焊和波峰焊温度曲线。
14.Familiar Wave soldering process. Familiar with assembly and packing process.熟悉波峰焊制程，熟悉组装和包装制程。
15.The Research of Sn-Zn System without Ag Lead-free Solder新型Sn-Cu系无银无铅焊料的研究
16.Investigation on Fabrication of a Low Melting Point Lead-free Sn-Bi-X Solders and Lead-free Soldering Process;低熔点无铅焊料Sn-Bi-X的研制与无铅焊接工艺研究
17.Application and Development of Surface Mount Technology;从有铅向无铅焊接过渡阶段应注意的问题
18.Effect of Cooling Rate on Quality of Solder Joints in Lead-Free Reflow Soldering;无铅回流焊冷却速率对焊点质量的影响
相关短句/例句
lead-free soldering无铅焊
3)Pb-free solder无铅焊料
1.This paper describes the development background,kinds,required characleristic,processes and future theme ofPb-free solder plating.概述了无铅焊料镀层的开发背景、种类、要求的特性、工艺和今后的课题。
4)lead-free solder joint无铅焊点
1.Reliability oflead-free solder joint for FCOB in hygrothermal environment;湿热环境下倒装焊无铅焊点的可靠性
2.Effect of Sb doped SnAgCulead-free solder joint on electromigration reliability;Sb掺杂对SnAgCu无铅焊点电迁移可靠性的影响
3.Failure analysis oflead-free solder joints based on resistance strain critical point基于电阻应变临界点的无铅焊点失效分析
5)lead-free solder无铅焊料
1.Effect of Er on microstructure and properties of Sn-3.0Ag-0.5Culead-free solder alloy;稀土Er对Sn-3.0Ag-0.5Cu无铅焊料合金组织与性能的影响
2.Effect of cerium on the structure and properties of Sn-Ag-Culead-free solder;Ce对SnAgCu系无铅焊料合金组织和性能的影响
3.Properties of Sn-Zn alloys aslead-free solders;亚共晶Sn-Zn系合金无铅焊料的性能
6)lead-free[英][,led "fri:][美]["l?d "fri]无铅焊料
1.RoHS law endorsed by EU on electronic products quickens the tendency oflead-free solders.文章对无铅焊料的发展过程,Sn-Ag-Cu合金的性能进行了综述,重点介绍了Sn-Ag-Cu焊点的可靠性,包括试验法和有限元法。
2.Recently,lead-free solders are replacing Sn-Pb solders because of human health and the environmental protection and legal regulation worldwide.近年来环境和人类健康保护的要求和有关国际法规的压力使世界电子工业面临以无铅焊料代替传统锡铅焊料的迫切需求。
延伸阅读
波峰焊基础知识波峰面 ：波的表面均被一层氧化皮覆盖?它在沿焊料波的整个长度方向上几乎都保持静态?在波峰焊接过程中?PCB接触到锡波的前沿表面?氧化皮破裂?PCB前面的锡波无皲褶地被推向前进?这说明整个氧化皮与PCB以同样的速度移动 波峰焊机焊点成型：当PCB进入波峰面前端（A）时?基板与引脚被加热?并在未离开波峰面（B）之前?整个PCB浸在焊料中?即被焊料所桥联?但在离开波峰尾端的瞬间?少量的焊料由于润湿力的作用?粘附在焊盘上?并由于表面张力的原因?会出现以引线为中心收缩至最小状态?此时焊料与焊盘之间的润湿力大于两焊盘之间的焊料的内聚力。因此会形成饱满?圆整的焊点?离开波峰尾部的多余焊料?由于重力的原因?回落到锡锅中 。防止桥联的发生 1、使用可焊性好的元器件/PCB2、提高助焊剞的活性3、提高PCB的预热温度?增加焊盘的湿润性能4、提高焊料的温度5、去除有害杂质?减低焊料的内聚力?以利于两焊点之间的焊料分开 。波峰焊机中常见的预热方法 1、空气对流加热2、红外加热器加热3、热空气和辐射相结合的方法加热 波峰焊工艺曲线解析 1、润湿时间指焊点与焊料相接触后润湿开始的时间2、停留时间PCB上某一个焊点从接触波峰面到离开波峰面的时间3、预热温度预热温度是指PCB与波峰面接触前达到的温度4、焊接温度焊接温度是非常重要的焊接参数?通常高于焊料熔点（183°C ）50°C ~60°C大多数情况是指焊锡炉的温度实际运行时?所焊接的PCB焊点温度要低于炉温?这是因为PCB吸热的结果 SMA?型 元器件 ???度?面板?件 通孔器件?混? 90~100?面板?件 通孔器件 100~110?面板?件 混? 100~110多?板 通孔器件 115~125多?板 混? 115~125波峰焊工艺参数调节 1、波峰高度波峰高度是指波峰焊接中的PCB吃?高度。其?值通常控制在PCB板厚度的1/2~2/3,?大??致熔融的焊料流到PCB的表面?形成“??” 2、?送?角波峰焊?在安??除了使?器水平外??????送?置的?角?通过?角的???可以?控PCB?波峰面的焊接?????的?角??有助于焊料液?PCB更快的???使之返回???3、??刀所???刀?是SMA???焊接波峰后?在SMA的下方放置一?窄?的??口的“腔?”?窄?的腔?能吹出??流?尤如刀??故?“??刀”4、焊料?度的影?波峰焊接?程中?焊料的??主要是?源于PCB上焊?的?浸析??量的???致焊接缺陷增多5、助焊?6、工???的??波峰焊?的工????速??????焊接??和?角之?需要互相???反??整。 波峰焊接缺陷分析: 1.沾锡不良 POOR WETTING:
