无铅焊膏,lead-free solder paste
1)lead-free solder paste无铅焊膏
1.Study of a new flux forlead-free solder paste;无铅焊膏用助焊剂的制备与研究
2.Study of active substance for SnAgCulead-free solder pasteSnAgCu无铅焊膏用活性物质研究
英文短句/例句
1.Selection of Solder Paste in Electronic Assembly电子组装中无铅焊膏的选择(续完)
2.Study of active substance for SnAgCu lead-free solder pasteSnAgCu无铅焊膏用活性物质研究
3.The Synthesis of the New Activator and Applied in the Lead-free Solder Paste新型活化剂的合成及在无铅焊膏产品上的应用
4.Pb-free solders– Sn-Bi-Zn based with our own patent and their modification to fit for package applications.无铅焊锡—锡铋锌系无铅焊锡，材料设计、发，焊料（球、膏）发等。
5.Pb-free solders ? Sn-Bi-Zn based with our own patent and their modification to fit for package applications.无铅焊锡—锡铋锌系无铅焊锡，材料设计、开发，焊料（锡球、锡膏）开发等。
6.The most obvious is the necessity for increased reflow temperature.最明显的是，使用无铅锡膏必须提高回流焊温度。
7.The Improvement and Performance Analysis of Sn-Ag-Cu Lead-Free Solder Paste;Sn-Ag-Cu系无铅焊锡膏组成优化与性能研究
8.Application of Hydroxy-alkyl-amine to Lead-free Solder Paste烷基羟基胺在无铅焊锡膏制备中的应用
9.The Improvement of the Solder Paste Performance and the Effect of Composition on It;SMT无铅焊锡膏性能的改进及其组份对性能的影响
10.Study of the Reliability of Power Device with Lead-free Heat-sink Attachment;功率器件无铅焊料焊接层可靠性研究
11.Properties of Sn-3.0Ag-0.5Cu-xNi lead-free solders and soldering jointsSn-3.0Ag-0.5Cu-xNi无铅焊料及焊点的性能
12.Research of a Build-in Defect Inspection Algorithm for Lead-free Solder Paste Printing内置无铅锡膏印刷机的检测算法研究
13.The Research of Sn-Zn System without Ag Lead-free Solder新型Sn-Cu系无银无铅焊料的研究
14.Investigation on Fabrication of a Low Melting Point Lead-free Sn-Bi-X Solders and Lead-free Soldering Process;低熔点无铅焊料Sn-Bi-X的研制与无铅焊接工艺研究
15.Application and Development of Surface Mount Technology;从有铅向无铅焊接过渡阶段应注意的问题
16.Effect of Cooling Rate on Quality of Solder Joints in Lead-Free Reflow Soldering;无铅回流焊冷却速率对焊点质量的影响
17.SnAgCuBi-Solder Alloy Development and Its Joint Interfacial Behavior Study;SnAgCuBi系无铅焊料的开发及其焊点界面行为的研究
18.Study of Organic Activated Flux for Sn-9Zn Lead-free Solder;Sn-Zn无铅电子焊料有机活化助焊剂研究
相关短句/例句
lead-free soldering无铅焊
3)Pb-free solder无铅焊料
1.This paper describes the development background,kinds,required characleristic,processes and future theme ofPb-free solder plating.概述了无铅焊料镀层的开发背景、种类、要求的特性、工艺和今后的课题。
4)lead-free solder joint无铅焊点
1.Reliability oflead-free solder joint for FCOB in hygrothermal environment;湿热环境下倒装焊无铅焊点的可靠性
2.Effect of Sb doped SnAgCulead-free solder joint on electromigration reliability;Sb掺杂对SnAgCu无铅焊点电迁移可靠性的影响
3.Failure analysis oflead-free solder joints based on resistance strain critical point基于电阻应变临界点的无铅焊点失效分析
5)lead-free solder无铅焊料
1.Effect of Er on microstructure and properties of Sn-3.0Ag-0.5Culead-free solder alloy;稀土Er对Sn-3.0Ag-0.5Cu无铅焊料合金组织与性能的影响
2.Effect of cerium on the structure and properties of Sn-Ag-Culead-free solder;Ce对SnAgCu系无铅焊料合金组织和性能的影响
3.Properties of Sn-Zn alloys aslead-free solders;亚共晶Sn-Zn系合金无铅焊料的性能
6)lead-free[英][,led "fri:][美]["l?d "fri]无铅焊料
1.RoHS law endorsed by EU on electronic products quickens the tendency oflead-free solders.文章对无铅焊料的发展过程,Sn-Ag-Cu合金的性能进行了综述,重点介绍了Sn-Ag-Cu焊点的可靠性,包括试验法和有限元法。
2.Recently,lead-free solders are replacing Sn-Pb solders because of human health and the environmental protection and legal regulation worldwide.近年来环境和人类健康保护的要求和有关国际法规的压力使世界电子工业面临以无铅焊料代替传统锡铅焊料的迫切需求。
延伸阅读
焊膏印刷工艺选择焊膏：应使用第3类(锡球尺寸为25至45微米)或第四类(20至38微米)的锡膏，选择哪一类取决于模板开孔的尺寸。建议使用低卤化物含量(<100 PPM)和免清洗的、J-STD-00指定的ROL0/REL0树脂助焊剂，可以省去回流装配后的清洗工作。 制作模板：使用激光切割不锈钢箔片加电抛光技术或镍金属电铸成形的制作工艺。镍电铸成形工艺虽然比较昂贵，但是对于从超小的开孔进行焊膏沉积的过程最具可重复性。这种方法还有一个优点，可以形成任何用户所需要的厚度。具有梯形截面的模板开口有助于焊膏的释放。 焊锡模板开口设计：对于激光切割SS使用纵横比为0.75的孔径；对于镍金属电铸成形，使用纵横比为0.66的孔径，方圆形(25微米角径)开口有助于焊膏沉积的重复性。孔径纵横比定义为孔径开口面积除以孔径边缘的面积。也可以使用偏离基板焊盘的X、Y坐标轴，使每个焊点的粘贴沉积度最强，焊点之间的影响最小。 焊锡模板的厚度：焊锡模板的厚度应该不超过焊点的高度，必须达到实际孔径设计所对应的纵横比的要求。在采用混合技术的PCB装配中，如果这些模板要求与其他SMT元件的要求相冲突，可以使用符合IPC-7525设计标准的低一级的模板工艺或双印刷模板工艺。
