封装模块,encapsulated module
1)encapsulated module封装模块
英文短句/例句
1.Design of GFP Encapsulation and De-encapsulation Module in EoSEoS中GFP封装与解封装模块的设计
2.The Design and Realization of Encapsulation and Access Modeling on Modules模块的封装与调用模型的设计与实现
3.The Research of Small Form Factor Pluggable Transceiver with Digital Diagnose Monitor Function;带数字诊断功能的小封装光模块研究
4.Sintering Technology of Power Modules:A Packaging with Good Design功率模块的烧结技术——良好设计的封装
5.The Packaging Structure and Development Trend of Intelligent/smart Power Module智能功率模块的封装结构和发展趋势
6.Mask Subsystem Design of Boiler Model under Matlab/SimulinkMatlab/Simulink环境下锅炉模块封装子系统设计
7.Power Electronics Modules Packaging and Integrative Packaging--Focusing on the Renewable Energy and Electric Vehicles功率模块的封装和“一体化”封装——一针对可再生能源和电动交通工具
8.Research on EMI Shielding Inside Hybrid Intergrated Power Electronic Module混合封装电力电子集成模块内电磁干扰的屏蔽
9.Study on the Dissipation and Packaging of High Power Laser Diode Module;大功率半导体激光模块的散热与封装研究
10.Research on Integration of the Vision and Motion Parts in Pre-Bonding Module of RFID Packaging Machine;RFID封装线预绑定模块的视觉与运动集成研究
11.The Company"s primary business is IC component packaging and test and memory module assembly.公司的主要业务是集成电路封装测试和内存模块装配。
12.On the modular design of the form - fill - seal packaging machine based on reverse engineering;基于反求工程的制袋—充填—封口包装机模块化设计
13.Integrated power electronics module based on chip scale packaged power devices基于芯片尺寸封装功率器件的集成电力电子模块(英文)
14.Encapsulation of Refrigeration Compressor Performance Test Data Acquisition Module Base on ActiveX Technique基于ActiveX技术的压缩机性能测试数据采集模块的封装
15.Optimised Integration of PrimePACK~(TM) into Modular IGBT Stacks with Increased Power DensityPrimePACK~(TM)封装优化集成模块内的IGBT叠层可提高功率密度
16.&Module Load Breakpoint...模块装载断点(&M)...
17.The software and hardware design of remotely controlled sealing and unsealing of plugging module封堵模块遥控密封和解封的软硬件设计研究
18.password protected load module file口令保护装入模块程序
相关短句/例句
module encapsulation模块封装
1.A design ofmodule encapsulation of C programs by using class programming is proposed in this paper, based on analyzing the characteristics of C and C++ programs and illustrated bymodule encapsulation of multiple serial ports driver programming in single-chip computer system in order to improve the quality of programs.在分析C程序和C++程序特点的基础上,以单片机系统多串口设备驱动程序的模块化设计为例,提出一种采用类设计思想,实现C程序模块封装的方案,以提高程序设计质量。
3)modularized encapsulation模块化封装
4)MOMEMS模块式封装
5)packaging module封装体模块
6)new IGBT module package新型IGBT模块封装
延伸阅读
封装分子式：CAS号：性质：一种处置毒性废物的方法。是将毒性废物铸入某些类似混凝土的材质中，使之与外界隔离，不污染水，并有抑制毒性作用。如将放射性废物封装在玻璃制品内，然后再存放在安全处。
