余料,excess stock
1)excess stock余料
英文短句/例句
1.Studies on the Processing Technologies of the Frozen French Fries and Its Residues马铃薯薯条及其余料加工工艺的研究
2.Trim a way the excess fabric at the seamline.剪掉缝线处多余的面料。
3.The Study of the Long Persistent Phosphor SrAl_2O_4: Eu, Dy;SrAl_2O_4：Eu，Dy长余辉材料研究
4.balance of stores records材料记录余额;库存平衡记录;库存余额记录
5.Distribution of Traps in Long Afterglow Phosphors and Its Effect on the Afterglow;长余辉材料陷阱分布及其对余辉的影响
6.Determination of the screened material from dyestuffGB/T1715-1979颜料筛余物测定法
7.Determination of residue on sieve of pigment--Mechanical flushing procedureGB/T5211.14-1988颜料筛余物的测定机械冲洗法
8.At last, we give our opinion on the probable development of LLP materials in future.提出了对长余辉材料今后发展的看法。
9.Lien Hoe to Redeem the Remaining 65% of Bonds before the End of the Year联和料在年底之前，可赎回余下65％债券
10.There are undoubtedly more than sufficient of all raw materials.毫无疑问，所有的原料都是绰绰有余的。
11.Numerical Simulation of Thermal Residual Stresses in Titanium Matrix Composites;钛基复合材料热残余应力的数值模拟
12.Effect of Residual Stress on the Properties of Piezoelectric Thin Films;残余应力对压电薄膜材料性能的影响
13.Researching the Historical FuYu and WoZu People from Archaeology Material;从考古学材料看历史上的夫余、沃沮人
14.Finite Element Analysis of SiCp/AlSi3 Composites Thermal Residual StressSiCp/AlSi3复合材料热残余应力有限元分析
15.Study on the Post-Impact Strength of 2.5D Woven Composites2.5D机织复合材料冲击后剩余强度研究
16.Some questions of the LLP materials, such as its phosphorescent mechanism, are also discussed.对长余辉材料中的一些问题,如余辉机理等进行了总结和探讨。
17.any materials unused and rejected as worthless or unwanted.不用和废弃的材料，被视为无价值或多余的。
18.a device that indicates the amount of fuel remaining in a vehicle.能够显示车辆中还有多少剩余燃料的装置。
相关短句/例句
utilization of remnant plate板材余料
3)the side surplus material边余料
4)Remaining fuel剩余燃料
5)remains management余料管理
1.Theremains management of steel is also discussed and the solution is presented.另外,还从加强过程控制出发,对典型结构进行分析,提出提高钢材利用率的具有可行性的系列技术方法,以及余料管理的原则和方法。
6)remnant utilization余料利用
延伸阅读
基板材料分子式：CAS号：性质：制造半导体元件及印制电路板的基础材料。如半导体工业用的材料硅、砷化镓、硅外延蓝宝石(SOS)、钆镓柘榴石(GGG)等，这些制造半导体元件用的基材均需单晶结构。由高纯度氧化铝(矾土)为主要原料经高压成型、高温烧成，再经切割、抛光制成的陶瓷基片是制造厚膜、薄膜电路的基础材料。覆铜箔层压板(简称覆箔板)是制造印制电路板的基板材料，它除了用作支撑各种元器件外，并能实现它们之间的电气连接或电绝缘。是由酚醛树脂、环氧树脂、聚酰亚胺树脂、聚四氟乙烯树脂、双马来酰亚胺三嗪树脂(又称BT树脂)等与纸或玻璃纤维布与铜箔层压制成。
