低温固化,Low temperature curing
1)Low temperature curing低温固化
1.The factors influencing the electrodeposion effects and film properties and the technology processes for high or low temperature curing were disscussed.合成了用于阳极电泳漆的阴离子丙烯酸树脂,研究了影响树脂电沉积效果和涂膜性能的因素,探讨了涂膜在高温和低温固化的实现途径。
2.The low temperature curing DP finishing of cotton clothes is performed with modified DMDHEU/hydro-chloric acid system and modified DMDHEU/phosphoric acid system, and provided that process conditions are properly controlled, the quality indexes of the finished fabric are satisfactory and energy saving is effected as well.采用以矿物酸作为树脂整理催化剂的改性2D树脂/盐酸和改性2D树脂/磷酸两系统,用于棉服装低温固化耐久定形整理工艺。
3.The selection of the adhesive ingredient,the curing mechanism of epoxy resin at low temperature and its low temperature curing properties are described,and the influence of flame retardant and smoke suppreressive filler on the properties of the adhesive is discussed.论述了阻燃胶粘剂配方的选择、环氧树脂的低温固化机理和固化性能,讨论了无机复合阻燃抑烟填料对胶粘剂性能的影响。
英文短句/例句
1.Study on curing reaction kinetics of low temperature curable BMI modified by PESPES改性低温固化双马树脂固化动力学研究
2.Preparation of Nonionic Waterborne Low Temperature Epoxy Curing Agent and Its Curing Process非离子水性环氧低温固化剂的制备及固化研究
3.Preparation and properties of low temperature curable cathodic electrodeposition coatings低温固化阴极电泳涂料的制备与性能
4.Study on kinetics of modified BMI resin matrix with low temperature curable低温固化改性BMI树脂基体动力学研究
5.One Fast Flow of Low Temperature Curing Adhesive Underfill一种快速流动可低温固化的底部填充胶
6.Property of Low Temperature Solidified Fingerprint Resistant Film on Electrogalvanized Steel Plate电镀锌钢板上低温固化耐指纹膜的性能
7.Chemo-rheological model of low temperature curing bisphenol-F epoxy resin system低温固化双酚F型环氧树脂体系的化学流变模型
8.Two components modified epoxy with barrier pigment. Low temperature curing.含有封闭型填料的双组分改性环氧漆。可低温固化。
9.A Low-Cure-Temperature Copper Nano Ink for Highly Conductive Printed Electrodes可用于高导电性印刷电极的低温固化纳米铜墨水
10.Synthesis of Low Temperature Curing Organic Urea Hardener and Its Application in Epoxy Powder Coatings有机脲类低温固化剂的合成及其在环氧粉末涂料中的应用
11.Low-Temperature Solid-State Synthesis of Metal Oxide and Sulfide Nanomaterials金属氧化物硫化物纳米材料的低温固相合成
12.When curing temperature below glassy temperature of adhesive coating, bonding strength is reduce with curing extent increase.固化温度低于胶层的玻璃化温度时，粘接强度随着固化程度的提高而降低。
13.Study on the Low-temperature Extraction of Green Tea Based on the Immobilized-enzyme Technology基于固定化酶技术的绿茶低温浸提工艺
14.Study on synthesis of epoxy resin adhesive with fast-curing feature at low temperature低温快速固化环氧树脂胶粘剂的合成研究
15.The Study on Structural Adhesive of Modified Epoxy Resin Curing in Water at Low Temperature for Architecture;建筑物加固用低温水中固化改性环氧胶粘剂的研制
16.Study on Preparation of Oxide Powders Used as High Temperature Structural Ceramics via Solid State Reaction at Low-heating Temperature低温固相法制备高温结构陶瓷用氧化物粉体研究
17.Study on Ethanol Production by Ultra-low Temperature Superfine Grinding and Immobilized Cellulas Hydrolysis from Lignocellulose;木质纤维素超低温微化—固定化酶降解制备乙醇工艺研究
18.OPTIMIZATION OF SDC-(Li/Na)_2 CO_3 COMPOSITE ELECTROLYTE FOR LOW-TEMPERATURE SOLID OXIDE FUEL CELL APPLICATIONS低温固体氧化物燃料电池SDC-(Li/Na)_2CO_3复合电解质材料优化
相关短句/例句
low-temperature setting低温固化
1.Investigation onlow-temperature setting bismaleimide resin system for filament winding;缠绕用无溶剂低温固化双马来酰亚胺树脂体系
2.The advantages of CS-1 solidification grains arelow-temperature setting, short consolidation periodand.试验表明,CS-1防砂固结颗粒具有低温固化,固结时间短,固结强度高的特点。
3)low temperature curing agent低温固化剂
1.Research progress oflow temperature curing agent for epoxy resin composites;环氧复合材料低温固化剂研究进展
4)low temperature fast curing低温快固化
1.This paper studies the formula and some properties of a new class Flow temperature fast curing solvent impregnating varnish .论文介绍了一种新型 F级低温快固化有溶剂浸渍漆的合成及其工艺性能 ,对该漆性能的影响因素进行了分析。
5)middle or low-temperature curing中低温固化
6)low-moderate temperature cure低中温固化
延伸阅读
低温固化银浆分子式：CAS号：性质：足以超细片状银粉为导电相的厚膜导体浆料，不含玻璃黏结剂，只在300℃以下温度进固化处理。有FAg-A1，TCAg-B1，TCAg-B4等，固化温度分别为80℃，120℃和90℃。通常用超细银粉或光亮银粉与溶有特殊树脂的有机黏合剂调和均匀而成。固化法包括传统空气中加热和红外固化。使用时经丝网印刷、浸渍、喷涂、涂刷和压制等方法制得牢固的导电银膜。用于固体钽电解电容器的负极过渡层、电磁屏导电膜、镀铜底层。此外也用于碳膜电阻器和印刷电阻电路的端电极等。
