晶粒尺度,grain size
1)grain size晶粒尺度
1.A special heat treatment process was used to separate the microstructural parameters, mainlygrain size and lamellar spacing.通过特定的热处理工艺，分离出全片层组织的晶粒尺度和片层厚度两个主要的显微组织参数，研究了晶粒尺度和片层间距对全片层组织合金的强化效果。
2.The effects ofgrain size on the tensile ductility in a TiAl alloy with duplex structure have been studied.探讨了双态组织TiAl基合金中晶粒尺度对合金常温拉伸塑性的影响。
3.Fully lamellar microstructures with four differentgrain sizes for constant lamellar spacing and two different lamellar spacings for constantgrain size have been obtained by means of various heat treatments.研究表明 ,通过不同的热处理制度可以得到具有相同片层厚度的 4种晶粒尺度 ,以及晶粒尺度大约为 45 0 μm,片层厚度分别为 15 0 nm和5 0 0 nm的组织。
2)ratio of thickness to grain size厚度/晶粒尺寸比
3)grain scale model晶粒尺度模型
4)grain size晶粒尺寸
1.Influence of wire rolling process parameters on austenitegrain size of high carbon steel;高碳钢线材轧制工艺参数对晶粒尺寸的影响
2.Prediction of the flow behavior andgrain size during forming for nickel alloy heavy forging;镍基合金大锻件成形过程流变行为与晶粒尺寸预测
3.Modelling forgrain size and flow stress of magnesium alloy based on BP neural network;基于BP神经网络的镁合金晶粒尺寸及流变应力模型
英文短句/例句
1.The Effect of Grain Size on Dynamic Properties of Pure Aluminum;晶粒尺寸对纯铝动态力学性能的影响
2.INFLUENCE OF GRAIN SIZE ON TWIP EFFECT IN A TWIP STEELTWIP钢中晶粒尺寸对TWIP效应的影响
3.Austenite grain size and continuous cooling transformation behavior in 20CrMoNb gear steel齿轮钢20CrMoNb奥氏体晶粒尺寸及相变行为
4.Distribution of Grain Size and Grain Angle in Grain Line Structure of Bi_4Si_3O_(12) Micro-crystals硅酸铋(Bi_4Si_3O_(12))晶列结构中的晶粒尺寸和晶粒夹角分布
5.The size effect in steel is attributed mainly to the grain size of the material.钢内的尺寸效应主要认为是由于材料的晶粒尺寸造成的。
6.Study on Grain Refinement of Aluminum Rod of Large-Size Processed by Equal Channel Angular Pressing;等径角挤压法细化大尺寸铝棒材晶粒尺寸的研究
7.β-Grain Growth and Influence of Its Grain Size on Damage-Tolerance Property in Titanium Alloy钛合金β晶粒生长规律及晶粒尺寸对损伤容限性能的影响
8.At first a comprehensive and short review on the characteristics for size growth-rate of crystals is presented.首先对微晶粒尺寸增长速率的表征进行总结.
9.Grain size had some effect on the rate of crack propagation.晶粒尺寸大小对裂纹扩展速率也有影响。
10.Research to the Influence of Dielectric Performance of Ceramic BaTiO_3 by Grain Size Effect;晶粒尺寸对钛酸钡陶瓷的介电性能影响的研究
11.Fem Simulation and Predication of Grain Size in Roughing Roll for Bar Steel;棒材粗轧过程的有限元模拟和晶粒尺寸预报
12.High Temperature Deformation Behavior of TC4 Titanium Alloy with Different Grain Sizes;不同晶粒尺寸TC4钛合金高温变形行为研究
13.UO_2 Pellets Grain Size Evaluation and Analysis in Yfp;核燃料元件厂UO_2芯块晶粒尺寸评价及分析
14.Hydrothermal Synthesis of Titania Powder with Different Particle Sizes水热法制备不同晶粒尺寸的纳米二氧化钛
15.Austenite grain size and hardenability of Nb-B microalloyed gear steels铌硼微合金化齿轮钢的晶粒尺寸及淬透性
16.Grain size effect of charge ordering of Bi_(0.2)Ca_(0.8)MnO_3晶粒尺寸对Bi_(0.2)Ca_(0.8)MnO_3电荷有序的影响
17.Influence of different grain size on mechanical properties of CVD diamond film不同晶粒尺寸对CVD金刚石膜机械性能的影响
18.Effect of grain sizes on domain structures in Al_2O_3/LiTaO_3 composite ceramics晶粒尺寸对Al_2O_3/LiTaO_3复合陶瓷中电畴结构的影响
相关短句/例句
ratio of thickness to grain size厚度/晶粒尺寸比
3)grain scale model晶粒尺度模型
4)grain size晶粒尺寸
1.Influence of wire rolling process parameters on austenitegrain size of high carbon steel;高碳钢线材轧制工艺参数对晶粒尺寸的影响
2.Prediction of the flow behavior andgrain size during forming for nickel alloy heavy forging;镍基合金大锻件成形过程流变行为与晶粒尺寸预测
3.Modelling forgrain size and flow stress of magnesium alloy based on BP neural network;基于BP神经网络的镁合金晶粒尺寸及流变应力模型
5)crystallite size晶粒尺寸
1.Determination ofcrystallite size and strain by X-ray powder晶粒尺寸和应变的X射线粉末衍射法测定
2.The effects of the amount of Gd~ 3+ -doping and calcination temperature on the photocatalytic activity for photocatalytic degradation of methylene blue (MB) in aqueous solution, phase structure,crystallite size, surface texture properties of the nanopowders were investigated,and t.研究了Gd3+掺杂量和焙烧温度对样品光催化降解亚甲基蓝的活性、相结构、晶粒尺寸和表面织构特性的影响,并结合表面光电特性和表面组成等探讨了Gd3+掺杂对纳米TiO2的光催化活性的影响机制。
3.The effects of pHinitial value, hydrothermal temperature and hydrothermal time on the morphology, crystal phase andcrystallite size of TiO2 powder were investigated.研究了反应初始pH值、水热反应温度和水热反应时间对TiO2形貌、物相和晶粒尺寸的影响。
6)crystalline size晶粒尺寸
1.When Si and C contents were higher, Ti (C, N) changed to TiC and thecrystalline size decreased to 2—4nm.用脉冲直流等离子体辅助化学气相沉积(PCVD)方法在高速钢基体上沉积出新型Ti-Si-C-N超硬薄膜,Ti-Si-C-N薄膜为纳米晶/非晶复合结构(nc-Ti(C,N)/a-Si_3N_4/a-C—C),当薄膜中Si和C含量较高时,Ti(C,N)转变为TiC,晶粒尺寸减小到2—4 nm,薄膜晶粒尺寸和硬度的高温热稳定性均随沉积态薄膜中的原始晶粒尺寸减小而提高,当原始晶粒尺寸在8—10 nm之间时,晶粒尺寸和硬度热稳定性可达900℃；当原始晶粒尺寸在2—4 nm之间时,晶粒尺寸和硬度热稳定性可达1000℃,薄膜硬度和晶粒尺寸表现出同步的高温热稳定性,分析认为由调幅分解形成的纳米复合结构中的非晶相强烈地抑制晶界滑移与晶粒长大,从而使Ti-Si-C-N薄膜的热稳定性显著提高。
2.The effects of pH value,hydrothermal temperature and time on the morphology andcrystalline size of nanoscale rutile TiO_2 were discussed.研究了pH值、水热反应温度和水热反应时间对金红石型纳米二氧化钛形貌和晶粒尺寸的影响。
3.Influence of chromium additions on thecrystalline size and magnetic properties of nanocom-posite Nd2Fe14B/.5,1,2)的纳米晶复合永磁合金,研究了Cr的添加对合金晶粒尺寸及磁性能的影响,结果表明适量Cr的添加能有效抑制磁性相晶粒长大,提高了合金的矫顽力。
延伸阅读
Assembly晶粒封装以树酯或陶瓷材料，将晶粒包在其中，以达到保护晶粒，隔绝环境污染的目的，而此一连串的加工过程，即称为晶粒封装（assembly）。封装的材料不同，其封装的作法亦不同，本公司几乎都是以树酯材料作晶粒的封装，制程包括：芯片切割→晶粒目检→晶粒上「架」（导线架，即lead frame）→焊线→模压封装→稳定烘烤（使树酯物性稳定）→切框、弯脚成型→脚沾锡→盖印→完成。以树酯为材料之ic，通常用于消费性产品，如计算机、计算器，而以陶瓷作封装材料之ic，属于高性赖度之组件，通常用于飞弹、火箭等较精密的产品上。
